LED ceramic thermal substrate is introduced

LED ceramic thermal substrate is introduced

How to reduce the grain ceramic substrate LED heat of the thermal resistance to the ascending LED light one of the most main topic efficiency, according to its production lines if method can be divided into thick film ceramic substrates, low temperature co-firing multi-layer ceramics, and film ceramic substrates three respectively, stated below:

3.1 thick film ceramic substrates

Thick film ceramic substrates by net printing technology is the production, by spatula printed material base board, after drying, burn ", such as a laser steps, and the domestic thick film ceramic substrates main manufacturers stretch for grain, nine companies such as Howard hall. General and speech, screen printing production line because of the way net edition web question, easy to produce the line rough, registration inaccurate phenomenon. Because of this, for the future size requirement more and more small, more and more subtle line of high power LED products, also or requirements of accurate alignment eutectic or flip chip process production LED products it, thick film ceramic substrates precision has gradually don't apply to use.

3.2 low temperature co-firing multilayer ceramic

Low temperature co-firing multi-layer ceramics and ceramic technology as a substrate materials, will use nets printed circuit board printing methods around, then integrated multilayer ceramic substrates, finally through low temperature sintering and become, and the main domestic manufacturers have Jing DE electronics, äf xin, etc. And low temperature co-firing multilayer ceramic substrates metal layer also is the line of nets printed, as it is possible process is made for web caused, in addition, the error registration multi-layer ceramics overlying sintering after he consider the proportion of the problem. Contract Therefore, if the low temperature co-firing multilayer ceramic used in line registration requirements of precision eutectic/flip chip LED products, will be more show harsh.

3.3 film ceramic substrates

In order to improve thick film process web problems, and multilayer the overlying sintering proportion issues, recent contraction after developing film ceramic substrates as LED the grain size of the base board heat. Film cooling substrate is splashed plating, electric/using electrochemical deposition, and yellow lithography process production and become, have:

(1) process at low temperature (300 ¡æ below), to avoid the high temperature material damage or size the possibility of variation;

(2) use HuangGuangWei shadow process, let a substrate line more precise;

(3) metal line is not easy to fall off... Wait for a characteristic, therefore film ceramic substrates used in high power, small feet inch, high brightness LED, and require high accuracy vs the eutectic/flip chip packaging process. And at present domestic mainly Ai SiBai electronic and electric companies such as with hin, with the professional film ceramic substrates production capacity.

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