Led chips grading methods

Led chips, compare grading methods for all!!!!!

Discovery
Level A product
ESD MM-> 100 V, IV > 5 mW; But as the led lighting use; Every piece of can cut 40 * 40 mil- 2000 hearts; After Sorting 1500 star can be used; Each star cost: USD (50.27 + 24.67) / 1500 = 0.05 / star; Price USD0.3 / stars.

Grade B product
ESD > 50 MM-> 5 mW V, IV; Can be used as display backlighting use; Every piece of can cut 11 * 13 mil- 25000 hearts; After Sorting 20000 star can be used; Each Kpcs cost: USD (50.27 + 24.67) / 20 Kpcs = 3.75 / Kpcs; Price USD 10 / Kpcs.

C
IV > 3 mW grade product; But as a general use; Every piece of can cut 11 * 9 mil- 30000 hearts; Each Kpcs
Cost: USD (50.27 + 24.67) / 30 Kpcs = 2.5 / Kpcs; Price USD 4.5 / Kpcs.
Regular on-but: it is to point to by manufacturer of selection of: brightness, voltage, antistatic ability, color difference is in the same standard of the range
Wafer: means not selected: brightness differ big, voltage fluctuation, antistatic ability is not consistent, run wavelength (color)!!!!! Pig feather bar: wafer of bad all has, the biggest characteristic is what color has a simple, not just the wavelength of the large span!!!!!
A: is the regular square slice completely selected, and ensure that number. Formal party B: refers to the piece does not guarantee that number of but selected. Regular square slice A > formal put A B > > > wafer pig feather bar
Scattered crystal.
Wafer is one that is not selected, but the extension of the chip) made around the can't use part removed
Chip come in? Extension of production process is very complex, long the extension of the extension, in each of smoke sampling test at nine o 'clock, to meet the requirements of is good quality products, other for bad product (voltage bias is very big, wide wavelength or partial long and so on) short. Good parts of the extension will begin to do electrode extremely, extremely (P), then use laser cutting extension, and then of sorting through, according to different voltage, the wavelengths, brightness for automatic HuaFen inspection, also is the formation of LED chips (party pieces). Then will the visual, a little defective or damaged electrode, separated out, these are scattered behind the crystal. At this point in the blue film have to normal delivery requirements of the chip, also naturally became the edge piece or feather bar, etc. Bad product of the extension (mainly there are some parameters requirements), don't have to do square slice, electrode (P very directly, N extremely), also don't do sorting, which is also currently on the market LED wafer (this is also have something good, be like square piece etc).

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