The LED packaging development trend reading: technology research and development is the way to go

The LED packaging development trend reading: technology research and development is the way to go

LED light by the landscape lighting expansion of energy-saving lamps to functional lighting and was eventually outdoor enter household is the trend of The Times.LED lamp life long, fast response characteristics, and also very suitable for application in intelligence. For example, using infrared control led lamp, the night light, stair lamp, don't try very hard to clap, stamp, cough, very convenient.

Recently, a visit to Beijing by the river miles, Switzerland abundant international, lights and a number of market of lamps and lanterns, found that LED home lighting products started pouring into the market of lamps and lanterns. "' 'LED lights in the price is higher, the impact of the consumers' desire to buy. "' 'Beijing city lights a dealer said, lamps and lanterns, for example in Beijing market, 3 watts of LED lights sells for $20, 7 watts of soared to 90 yuan; And energy-saving fluorescent lamps usually 10 yuan can be bought, incandescent lamp for 1 yuan.

At present, the LED lighting is not suitable for family lighting. "' 'used LED to absorb dome light of Beijing's residents Mr Liu said, LED lamp do save energy, environment protection, but too bright, too, used to changed back to the ordinary energy-saving lamps. At present, the domestic LED domestic lighting still has some problems. One is the heat dissipation problems, and the domestic aluminum radiator, this process is multi-purpose radiator if and LED chips not stick tight, it will affect LED lamp life; 2 it is the DiaoJi problem, the brightness need a controller to adjust. If domestic enterprise only care about '"' horse race circle '"', don't put idea on technology research and development and meet market demand, it will be difficult to really get into energy-saving LED lives in the market. The LED encapsulation principle

The LED encapsulation is mainly provides LED chips a platform, let LED chips have better light, electricity, heat performance, good packaging can let LED have better luminous efficiency and good thermal environment, good thermal environment and to enhance the service life of the LED. The LED encapsulation technology is based on five major consideration, respectively for optical remove efficiency, thermal resistance, power dissipation, reliability and performance to price ratio (Lm / $).

Above each factor in the package is very important link, for example, the light out related to the ratio of the efficiency; Thermal resistance related to the reliability and product life; Power dissipation in relation to customer application. Overall, better packaging technology to give each point is a must, but the most important thing is to a customer's position thinking, can satisfy the customers' needs and beyond, it is good to enclose.

According to the packaging material composition, LED LinZhiMin detailed explain a way, LED encapsulation is mainly composed of substrate, chip, solid crystal glue, phosphor, encapsulation glue and other components, we first will use glue stick crystal chips solid base board, use gold line will chip and the board for electrical connections, and then will phosphor and packaging glue mixing with different proportion of phosphor, and appropriate chip wavelength can get different color and will last a phosphor and packaging of glue mixture into the base board, heating baking enables the glue material after curing, that is the most basic LED to complete package. The LED packaging development trend. Four

The LED encapsulation technology is mainly to high luminous efficiency, high reliability, high heat capacity and thin such development. From the chip to see, at present the most popular is ShuiPingShi chip, more high-end manufacturers are r&d vertical chip and the crystal chips, ShuiPingShi original use LED sapphire substrates, cooling ability is bad, and in high current drive, take out light efficiency declines bigger also. Therefore, in order to reduce cost, high current density LED the chip design and for more light output as the main research direction, in such consideration, by the use of vertical encapsulates the chip will become the next subject, such chips using silicon substrate, high heat in high current operating under a better cooling efficiency, so there is a higher light output, but the production process complex, process yield is too low, so that is unable to achieve the ideal high performance-to-price ratio, therefore, in high wattage encapsulation, process yield in the price also is a big factor consideration.

The LED encapsulation technology at present mainly to high luminous efficiency, high reliability, high heat capacity and the thin four direction, at present the main window have LED and silica high pressure LED, silica has attracted more and more LED industry of interest because it is better than the traditional basal LED the cooling capabilities of sapphire more strong, so the power can be bigger, with emphasis on development Cree silicon-based LED, its main problems existing is still low yield, lead to cost also is on the high side. High pressure LED is another big window, because it can dramatically reduce DC-DC step-down circuit of the input/output pressure difference, and further enhance the efficiency of the drive power LED, it can effectively reduce the LED to the requirements of the shell heat lamps and lanterns, and to reduce the LED lamps and lanterns of the overall cost of. At present, Osram Cree in and LED technology development high pressure. Light electronic ((Everlight) r&d ii everywhere long LinZhiMin said: "the future light will expand the development and application of high pressure LED products, integrate more components, to create simple application of the tiny light engine, in order to reduce the cost of lamps and lanterns, for the popularity of solid-state lighting as a heart."

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